Provides Extra Bandwidth Right into a Connector

On Dec. 9, IBM unveiled a breakthrough in co-packaging optics that might cut back GPU downtime and speed up AI training.

IBM’s working prototype considerably will increase the variety of optical fibers connecting on the fringe of a silicon photonics chip by changing conventional glass with a polymer optical waveguide. This progressive method might pave the best way for quicker, extra environment friendly information switch and permit information facilities to deal with higher workloads.

The concept of co-packaged optics has been round for a very long time, however IBM’s course of allows what the corporate calls the world’s first stress-tested prototype.

IBM spokespeople didn’t immediately tackle questions about availability or a timeline. As a substitute, they emphasised their intent to develop a roadmap and expressed their openness to sharing design materials with foundries sooner or later.

“On the finish, the chip product firms must ask for that, after which the product firms will design that into their chip design, and the foundries can manufacture,” Makesh Khare, common supervisor of IBM semiconductors, mentioned at a briefing. “However it has no particular requirement concerning the foundry facet. It should have a design facet we are able to present to the chip firms.”

What makes a polymer optical waveguide stand out?

Co-packaged optics with polymer optical waveguides are an alternative choice to copper connections and are sometimes used to hyperlink GPU accelerators in information facilities. These sit on the fringe of a chip and let many high-density bundles of optical fibers squeeze right into a tiny area, with half a micron or much less between the fiber and the connector. IBM mentioned this brings a dramatic bandwidth increase between chips in comparison with electrical connections.

The dimensions — a 50-micron pitch — additionally differentiates the prototype. 250-micron pitch is a regular measurement. Going smaller interprets to elevated bandwidth.

The polymer optical waveguide stacks in as much as 4 layers for as much as 128 channels. On the “beachfront” the place the connector meets the chip, it presents 51 fibers per millimeter.

“The large deal will not be solely that we’ve bought this large density enhancement for communications on module, however we’ve additionally demonstrated that that is suitable with stress assessments that optical hyperlinks haven’t been passing prior to now,” John Knickerbocker, distinguished engineer at IBM analysis, mentioned in a press launch.

“This co-packaged optics innovation is principally bringing the facility of fiber optics on the chip itself,” Khare added.

IBM’s polymer optical waveguide could compete with novel connectivity processes just like the Ranovus Odin digital and photonic built-in circuit or linear-drive pluggable optics. Researchers are additionally experimenting with glass ribbons or vertical-graded interconnections on this space.

Knickerbocker mentioned within the briefing: “It’s arduous to say who’s up in entrance“ between polymer optical waveguides and linear-drive pluggable optics.

IBM has manufactured co-packaged optics with polymer optical waveguides at its Bromont testing facility in Quebec.

SEE: Knowledge facilities will want extra energy for AI coaching as hyperscalers offer extra superior fashions.

The proposed market: Knowledge facilities used to coach AI

IBM proposes the brand new connector may benefit the booming generative AI industry by:

• Energy draw discount (of as much as 5 instances) mid-range electrical interconnects, together with at lengthy ranges (a whole bunch of meters).
• Discount within the time it takes to coach a big language mannequin, from three months to 3 weeks.
• Elevated power effectivity.

“With this breakthrough, tomorrow’s chips will talk very like how fiber optics cables carry information out and in of information facilities, ushering in a brand new period of quicker, extra sustainable communications that may deal with the AI workloads of the long run,” SVP and Director of Analysis Dario Gil mentioned in a press launch.