Tech Radar
Prime Samsung rival unveils “world’s largest capability” 16-Layer HBM3e chips — SK hynix guarantees boosted efficiency for all
Nov
- The 16-Layer HBM3e chips are anticipated to roll-out in 2025
- New chips provide improved AI studying and inference capabilities
- Customers can anticipate decrease latency, Sk hynix claims
SK hynix has introduced plans so as to add a further 4 layers to its 12-HI HBM3e reminiscence chips in a drive to bolster capability.
The transfer will see the corporate improve capability from 36GB to 48GB, and the semiconductor big expects to start distribution of pattern merchandise in early 2025.
The announcement may ship important efficiency enhancements for organizations ramping up AI improvement. HBM3e chips have historically boasted a most of 12 layers, however with the arrival of HBM4, customers can glean higher efficiency.
Stacked and prepared
Firm CEO Kwak Noh-Jung introduced the launche throughout its current SK AI Summit in Seoul, noting the improve will assist markedly enhance AI studying efficiency and inference capabilities.
“We stacked 16 DRAM chips to comprehend 48 GB capability and utilized Superior MR-MUF know-how confirmed for mass manufacturing. As well as, we’re creating hybrid bonding know-how as a backup course of,” he stated.
Kwak added preliminary in-house testing reveals the 16-layer HBM3e can enhance each AI studying and inference by 18% and 34% respectively in comparison with earlier 12-layer HBM3e
“The 16-layer HBM3E is deliberate to be commercialized in 2025,” Kwak revealed.
HBM4 presents over 10 Gbps per pin in comparison with the high-end most of 9.2 Gbps supplied by its predecessor. All informed, it will unlock bandwidth capabilities of as much as 1.5 TBps in comparison with HBM3e’s 1.2-plus TBps.
Furthermore, producers anticipate HBM4 may even ship decrease latency.
Below the hood of the 16-Hello product
When it comes to design, the 16-Hello product has been developed utilizing mass reflow-molded underfill (MR-MUF) know-how. This next-generation tech can allow warp-free stacking of chips which can be 40% thinner than typical alternate options.
This additionally delivers improved warmth dissipation as a result of using new protecting supplies, the corporate stated.
Equally, hybrid bonding has additionally unlocked marked enhancements. This entails immediately bonding chips with out the necessity for forming a ‘bump’ between them throughout stacking, SK hynix famous.
“This reduces the general thickness of the chip, enabling excessive stacking,” the corporate stated in an announcement. “SK hynix is each Superior MR-MUF and hybrid bonding strategies for 16-layer and better HBM merchandise.”
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